The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1994
Filed:
Mar. 28, 1991
Applicant:
Inventors:
Akira Nagai, Hitachi, JP;
Shin Nishimura, Hitachi, JP;
Masahiro Suzuki, Iwaki, JP;
Masao Suzuki, Hitachi, JP;
Junichi Katagiri, Ibaraki, JP;
Akio Takahashi, Hitachiota, JP;
Akio Mukoh, Mito, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528322 ; 528 97 ; 528 98 ; 528103 ; 528117 ; 528119 ; 528211 ; 528392 ; 528422 ; 428224 ; 4284111 ; 4284231 ; 428901 ; 526262 ;
Abstract
A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.