The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 1994

Filed:

May. 26, 1993
Applicant:
Inventors:

Noriyuki Matsuoka, Yokohama, JP;

Eisaku Tsubota, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 70 ; 439525 ;
Abstract

A socket for an IC package includes a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package. Each of the contacts comprises a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion. The first and second unitary contacts have male terminals separately connected to a wiring board, respectively.


Find Patent Forward Citations

Matsuoka, Noriyuki. (1994). Socket for ic package (U.S. Patent No. 5352124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5352124

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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