The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1994
Filed:
Jan. 04, 1994
James F Belcher, Plano, TX (US);
Gary W Andrews, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A bonding apparatus (40) having one or more electromagnets (60) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22). The bonding apparatus (40) includes an electrical control system (108) with a control unit (130) for varying the amount of electrical power supplied to the electromagnet (60). One or more heater assemblies (110) are provided for temperature cycling of the substrates (20 and 22) during the bonding process. Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling.