The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1994
Filed:
Nov. 03, 1993
Kuniaki Ochiai, Shizuoka, JP;
Shigeo Komakine, Shizuoka, JP;
Tokyo Electric Co., Ltd., Tokyo, JP;
Abstract
An adhesive layer 15 is formed over one major surface of a flat base plate 1 having a relatively high rigidity, a piezoelectric plate 2 is joined to the adhesive layer 15, a plurality of parallel grooves 3 are formed through the piezoelectric plate 2 into the adhesive layer 15, a metal is deposited over the surfaces of the grooves 3 to form electrodes 8, a top plate 10 is attached to the upper surface of the piezoelectric plate 2 so as to close the upper open ends of the grooves 3, and a nozzle plate 12 provided with a plurality of ink jets is attached to one end of the assembly of the base plate 1, the adhesive layer 15, the piezoelectric plate 2 and the top plate 10 so as to close the open longitudinal ends of the grooves 3 to form a plurality of pressure chambers 14. The upper side walls 4a of side walls 4 separating pressure chambers 14 from each other are formed of portions of the piezoelectric plate 2 and the lower side walls 4b of the side walls 4 are formed of portions of the adhesive layer 15 having a rigidity lower than that of the piezoelectric plate 2. Accordingly, the side walls 4 can be strained greatly. The electrodes 8 formed by electroless plating have few pinholes.