Cleaning device for a wafer mount plate

Abstract

A cleaning device for cleaning adhesive particles and other foreign matter from a disk-shaped wafer mount plate used in semiconductor fabrication comprises a plurality of support rollers supporting the wafer mount plate horizontally for rotation about its own axis. One or more driving rollers are brought into frictional contact with the peripheral side surface of the wafer mount plate to rotationally drive the same. An upper surface washing brush, a lower surface washing brush and a side surface washing brush are movable into brushing contact with the upper, lower and peripheral side surfaces, respectively, of the wafer mount plate for simultaneously brushing all the surfaces thereof while a washing liquid is sprayed thereon. Then rinsing liquid is sprayed on the wafer mount plate, which is thereafter dried by blowing drying gas thereon.