The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 1994
Filed:
Oct. 28, 1992
Kouichi Takekawa, Tokyo, JP;
Michitaka Urushima, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A film carrier semiconductor device includes a film carrier tape, an outer lead bonding bump mounting portion, a semiconductor chip, inner lead bonding leads, and outer lead bonding bumps. The film carrier tape consists of a tape-like insulating material and has carrying and positioning sprocket holes in its both edge portions. The outer lead bonding bump mounting portion is formed in a central portion of the film carrier tape. The semiconductor chip is mounted on the outer lead bonding bump mounting portion and has electrode bumps formed on electrode pads. The inner lead bonding leads are formed into a predetermined pattern on the film carrier tape and connected to the electrode bumps. The outer lead bonding bumps are formed on the outer lead bonding bump mounting portion, to each of which one end of a corresponding one of the inner lead bonding leads is connected.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile