The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 1994
Filed:
Aug. 25, 1992
Makoto Takeuchi, Nagano, JP;
Shiji Aiba, Nagano, JP;
Masatake Hoshina, Nagano, JP;
Minoru Yamazaki, Nagano, JP;
Nissei Plastic Industrial Co., Ltd., Nagano, JP;
Abstract
Upon setting various molding conditions relating to new molding, one or more than two of pseudo-correlation data Q1, Q2, Q3, Q4, Q5 . . . which are secondary physical values (a fluid pressure, a hold pressure, a pressure coefficient and the like) previously set in accordance with primary physical values (a thickness, a fluid length and the like) relating to a virtual molded article, and upon setting of the molding conditions, the molding conditions are computed from primary physical values relating to molding of an actual molded article in accordance with the correlation data Q1 . . . , the molding conditions including a design condition for dies or a result of analysis of operation.