The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 1994
Filed:
Oct. 26, 1992
Ryoichi Narita, Obu, JP;
Yutaka Fukuda, Kariya, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
A semiconductor element mounted on a board is sealed with a sealing resin, The semiconductor element is electrically bonded to the board through a soldering bump. The sealing resin includes a silicone gel as a base resin and a filler filled into a silicone gel. A diameter of the filler is equal to or shorter than the distance between the semiconductor element and the board, and a shape of the filler is spherical to improve a thermal conductivity of the sealing resin. The relationship between a coefficient .alpha. of a linear expansion and a complex modulus of elasticity G* of the sealing resin is defined as follows to reduce a force pushing up the semiconductor element: