The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 1994
Filed:
Feb. 02, 1993
Applicant:
Inventors:
Masanori Nishiguchi, Kanagawa, JP;
Atsushi Miki, Kanagawa, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; H05K / ;
U.S. Cl.
CPC ...
22818022 ; 29841 ; 257796 ; 257722 ;
Abstract
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Nishiguchi, Masanori. (1994). Method of mounting semiconductor elements (U.S. Patent No. 5348214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5348214
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile