The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 1994
Filed:
Jun. 08, 1993
Yoshihisa Maejima, Hamamatsu, JP;
Seiya Nishimura, Hamamatsu, JP;
Masayoshi Takabayashi, Hamamatsu, JP;
Tokuyoshi Ohta, Hamamatsu, JP;
Yamaha Corporation, Hamamatsu, JP;
Abstract
A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie bar is provided and connected among the leads. According to a method of making the lead frame, an IC-chip mounting process, a wire-bonding process, a sealing process, a resin-cutting process and a dambar-cutting process are sequentially effected on the lead frame. After effecting the dambar-cutting process, a thin-plating process is effected so as to form a thin-plated layer, approximately having a thickness of 5 .mu.m to 15 .mu.m, on the leads. Then, the leads are bent by a predetermined bending process. Thereafter, a thick-plating process is effected so as to form an uniform thick-plated layer, approximately having a thickness of 15 .mu.m to 100 .mu.m, on the leads. After effecting the thick-plating process, a trimming process is effected on the leads. Incidentally, the thin-plating process can be effected after the bending process and before the thick-plating process.