The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 1994

Filed:

Dec. 03, 1992
Applicant:
Inventors:

John C Carson, Corona del Mar, CA (US);

Ronald J Indin, Huntington Beach, CA (US);

Stuart N Shanken, Irvine, CA (US);

Assignee:

Irvine Sensors Corporation, Costa Mesa, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361760 ; 361728 ; 361807 ; 361735 ; 174260 ; 257686 ;
Abstract

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Published as:
WO9413121A1; US5347428A; EP0683968A1; JPH08504060A; EP0683968A4; EP0683968B1; DE69332957D1;

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