The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
Mar. 26, 1992
Applicant:
Inventors:
Takuya Fukuda, Hitachi, JP;
Michio Ohue, Hitachi, JP;
Fumiyuki Kanai, Hoya, JP;
Atsuyoshi Koike, Kokubunji, JP;
Katsuaki Saito, Hitachi, JP;
Kazuo Suzuki, Hitachi, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Engineering & Services, Inc., Hitachi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B44C / ;
U.S. Cl.
CPC ...
21912143 ; 21912144 ; 437228 ; 437235 ; 437245 ; 20429835 ; 156646 ;
Abstract
Disclosed are a semiconductor device comprising a semiconductor substrate, a first metal connection layers, a first substrate oxide layer having a specific form, and a second connection pattern layer; a process for producing the device; and a microwave plasma treatment apparatus having gas feed ports in a specific position. The highly reliable semiconductor devices can be produced at a high rate at high yields.