The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
Jan. 25, 1993
Dean M Moren, North St. Paul, MN (US);
Dean A Ersfeld, Maplewood, MN (US);
Minnesota Mining and Manufacturing Company, St. Paul, MN (US);
Abstract
The present invention provides a water-curable resin composition for use in the preparation of composite materials. The resin composition is composed of a water-reactive liquid organometallic compound having a viscosity of no greater than about 500,000 centipoise under ambient conditions; and a nonreactive organic thermoplastic polymer, having a number average molecular weight of at least about 1,000, mixed with the water-reactive liquid organometallic compound. Preferably, the water-reactive liquid organometallic compound is a compound of the formula (R.sup.1 O).sub.x MR.sup.2.sub.(y-x) wherein: each R.sup.1 is independently a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide--O--, --S--, --C(O)--, or --N-- groups; each R.sup.2 is independently selected from the group consisting of hydrogen and a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide--O--, --S--, --C(O)--, or --N-- groups; x is an integer between 1 and y, inclusive; y is the valence of M; and M is boron, aluminum, silicon, or titanium.