The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
May. 14, 1991
Applicant:
Inventors:
John W Lau, Gaithersburg, MD (US);
Jack H Enloe, Columbia, MD (US);
Assignee:
W. R. Grace & Co.-Conn., New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ; H05K / ;
U.S. Cl.
CPC ...
428210 ; 428209 ; 4283133 ; 4283144 ; 4283191 ; 428432 ; 428433 ; 428469 ; 428472 ; 428698 ; 428701 ; 428704 ; 428901 ;
Abstract
The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.