The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
Apr. 29, 1993
Hitoshi Hara, Funabashi, JP;
Toru Okuda, Nara, JP;
Sumitomo Heavy Industries, Ltd., Tokyo, JP;
Abstract
An injection molding method using an injection molding machine in which a plurality of control parameters including the injection speed, injection pressure and the mold opening degree are controlled, from a moment immediately before filling up of the mold cavity with the resin, setting the parameters in an order determined in accordance with the characteristics demanded by the resin, such that, when the injection pressure is controlled as a commanding parameter, the injection speed is controlled as a subordinate parameter under a given restriction and, when the mold opening degree is controlled as the commanding parameter, the injection pressure is controlled as a subordinate parameter under a given restriction. According to this method, it is possible to control the injection molding operation on the basis of a plurality of control parameters in accordance with characteristics demanded by the resin in the mold which varies time to time, thus making it possible to maximize the packing degree while minimizing burrs and short shot.