The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
Mar. 23, 1993
Robert J Baseman, Brewster, NY (US);
Charles A Brown, Los Gatos, CA (US);
Benjamin N Eldridge, Hopewell Junction, NY (US);
Laura B Rothman, South Kent, CT (US);
Herman R Wendt, San Jose, CA (US);
James T Yeh, Katonah, NY (US);
Arthur R Zingher, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
During wafer fabrication, a transportable enclosure, such as a Standard Manufacturing InterFace (SMIF) pod encloses a nascent product, such as a semiconductor wafer, to protect the wafer against contamination during manufacture, storage or transportation. However chemical vapors emitted inside the pod can accumulate in the air and degrade wafers during subsequent fabrication. In order to absorb the vapors inside a closed pod, a vapor removal element typically including an activated carbon absorber, covered by a particulate-filtering vapor-permeable barrier, and covered by a guard plate with holes is disposed within the enclosure. A vapor removal element is disposed closely adjacent to each respective wafer. Alternatively, a single vapor removal element is located inside the enclosure. In certain instances, a fan or thermo-buoyant circulation causes any vapors located inside the enclosure to a vapor removal element for removal. Alternatively a porous vapor removal element may be disposed for removing vapors from air entering the enclosure. In another embodiment a vapor removal element is integrated with the back face of each wafer.