The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1994
Filed:
Feb. 19, 1993
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.