The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 1994

Filed:

Feb. 19, 1993
Applicant:
Inventor:

James L Stortz, Spring, TX (US);

Assignee:

Compaq Computer Corporation, Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
347 20 ; 439 55 ; 347 50 ; 347 68 ;
Abstract

The body of a piezoelectrically operable ink jet printhead is mounted in an upper side surface groove formed in a mounting plate member. A rear bottom section of the printhead body has an exposed top side surface portion which is flush with the top side of the mounting plate member and terminates forwardly of its rear end. A high density parallel array of mutually spaced linear conductive traces is formed on this exposed top side surface portion of the printhead body, these traces being used to transmit electrical operating signals from a separate electronic driver to piezoelectrically drivable channel sidewall sections within the interior of the printhead body. A multi-tiered printed circuit board secured to the top side of the mounting plate member is used to connect the printhead to the electronic driver. The circuit board has a series of linear traces formed on its bottom side which register with and are soldered to the closely spaced printhead body traces, a spaced series of lower density spacing contact pads formed on its top side and releasably engageable with correspondingly spaced contact pads on the electronic driver, and internal crossover circuitry that operatively connects the high density underside linear traces of the circuit board to its lower density top side contact pads.


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