The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 1994

Filed:

Sep. 15, 1992
Applicant:
Inventors:

Albert Chanasyk, Hampton Falls, NH (US);

Walter J Hall, Waltham, MA (US);

J Robert Maxwell, Londonderry, NH (US);

Russell G Shaw, Contoocook, NH (US);

Roy J Palhof, Somersworth, NH (US);

Phillip D Bourgelais, Newmarket, NH (US);

Assignee:

Vitronics Corporation, Newmarket, NH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
219388 ; 219400 ;
Abstract

Apparatus for soldering surface mounted devices to printed circuit boards utilizing a combination of forced convection and infrared radiation. Fans are disposed in each heating zone which force gas through a heating plate which heats the air, emits infrared radiation for heating of printed circuit boards, and establishes a flow pattern for the gas. Flows are controlled in each zone by selectively introducing unheated gas into each zone, and by selectively exhausting gas from each zone. The volume of gas introduced and exhausted from each zone can be controlled. Closures are provided in the return channels to the low pressure side of the fan for controlling the volume of gas recirculated from the conveyor. Flow is controlled such that cooler air is always introduced into the zones which have a lower temperature and is exhausted from zones which have higher temperatures. As a consequence, the gas flow between zones can be controlled to maintain desired zone definition, to decouple zones from one another and to prevent overheating in any one zone. In this manner, the temperatures within each zone, and thus the temperatures of the printed circuit boards can be carefully controlled.


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