The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1994
Filed:
Aug. 21, 1992
Michael B McShane, Austin, TX (US);
Alan H Woosley, Austin, TX (US);
Francis Primeaux, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of encapsulating a semiconductor device permits use of the same mold for various package types. In one form, a mold (34 and 36) has a first cavity (50) in which a first insert (52 and 53) is positioned, the first insert defining a length and a width of a package body which is to be formed in the mold. The first insert in the first cavity also defines a second cavity (54) in which a second insert (56 and 57) is positioned, the second insert defining a thickness of the package body. Plastic is inserted into the mold to form the package body. To form other package types, one or more inserts are replaced instead of using a different mold. In another embodiment, the inserts are adjustable. For example, rather than having to change inserts to form a package with a different thickness, the inserts are adjusted by, for instance, a screw mechanism (66) within the mold or by the addition or removal of shims (60).