The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1994
Filed:
Oct. 15, 1992
James W Hendry, Brooksville, FL (US);
ICP Systems, Inc., Madison Heights, MI (US);
Abstract
A mold apparatus and method is used to form a solid injection molded plastic part having no internal voids, a Class A finish, a sink-free exterior appearance surface, and unevenly distributed structural detail extending from the opposite surface, the detail including free-standing reinforcement ribs, attachment bosses, and the like. In the method the mold portions of the mold apparatus are closed, charges of molten thermoplastic and pressurized gas are sequentially injected into a mold cavity defining the shape of the desired part, and the mold portions are sequentially separated and closed. The pressurized gas forces the hot plastic away from one mold half and against the other mold half, and separation of the mold portions ensures uniform distribution of the pressurized gas behind the hot plastic, which pressure is maintained during cooling. Depending on the application, the plastic completely packs the cavity, fills but does not pack the cavity, and the mating faces can be abutted or maintained partially separated when the mold portions reclosed. A gas seal is formed by the plastic to prevent gas in the mold cavity from reaching the finished exterior surface of the part during shrinkage of the plastic.