The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 1994

Filed:

Jan. 14, 1993
Applicant:
Inventor:

Horst Plankenhorn, Villingen-Schwenningen, DE;

Assignee:

Mannesmann Kienlze GmbH, Villingen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G / ;
U.S. Cl.
CPC ...
29 2541 ; 29 2542 ; 29413 ; 29414 ; 361280 ;
Abstract

A process for separating a glass-silicon-glass layer package wherein the glass-silicon-glass layer package is produced at a minimum process cost and is constructed from a plurality of acceleration sensors constructed with micro-mechanical structure techniques. At the same time, dirt is to be prevented from entering the acceleration sensors and the connection contacts are to be freed automatically. Separation is effected substantially by crosswise cutting and subsequent breaking. In order to prevent an 'opening' of the acceleration sensors when cutting in one direction, i.e. transversely relative to the flexural resonators, and to achieve a defined breaking, one glass disk is cut until a predetermined breaking point is reached and the other glass disk is severed in a parallel plane. An intermediate layer which surrounds the connection in a U-shaped manner, serves as a blocking layer arranged between the two dividing planes and impedes a bonding of the glass disk and the silicon disk.


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