The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 1994

Filed:

Dec. 14, 1992
Applicant:
Inventors:

John K Frei, Mesa, AZ (US);

Howard D Knuth, Tempe, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01D / ;
U.S. Cl.
CPC ...
333246 ; 333238 ; 29854 ; 29875 ; 29880 ;
Abstract

A reinforced wrap around ground and method includes a substrate, including opposite first and second substrate surfaces separated by a substrate edge. A first metalization layer is coupled to the first substrate surface and a second metalization layer comprising an electrical ground, is coupled to the second substrate surface. An electrical ground reinforcement is coupled between the first metalization layer and the second metalization layer around the substrate edge. Conductive paste coats the electrical ground reinforcement, and the conductive paste is fired to bind the wrap around ground to the substrate and to electrically ground the first metalization layer to the second metalization layer through the electrical ground reinforcement and the conductive coating.


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