The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1994
Filed:
Nov. 26, 1993
Applicant:
Inventor:
Hidenobu Miyamoto, Tokyo, JP;
Assignee:
Nec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 67 ; 437 52 ; 437 63 ; 148D / ;
Abstract
A conductive layer is formed on a semiconductor substrate, and is etched so that a side face of the conductive layer is reversely-tapered. Also, a sidewall insulating layer is formed on the side face of the conductive layer. Then, a groove is formed within the semiconductor substrate with a mask of the sidewall insulating layer, and an isolation insulating layer is buried within the groove.