The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 1994

Filed:

Nov. 29, 1993
Applicant:
Inventors:

Rumiko Hayase, Kawasaki, JP;

Masayuki Oba, Yokohama, JP;

Naoko Kihara, Matsudo, JP;

Yukihiro Mikogami, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ; G03F / ;
U.S. Cl.
CPC ...
430165 ; 430167 ; 430189 ; 430192 ; 430193 ; 430197 ; 430273 ; 430320 ; 430905 ; 430165 ;
Abstract

A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.


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Hayase, Rumiko. (1994). Photosensitive composition and resin-encapsulated semiconductor device (U.S. Patent No. 5340684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5340684

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