The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1994
Filed:
Aug. 18, 1992
Benjamin V Fasano, New Windsor, NY (US);
Vlad J Novotny, Cupertino, CA (US);
Lawrence B Schein, San Jose, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Conductive patterns are formed on a surface and via connections through a lamina or substrate are formed by directly writing an electrostatic charge pattern on a surface of the lamina and developing the written pattern by application of conductive particles thereto, preferably in a liquid suspension of particulate material including a binder and/or a charge control agent. High resolution patterns are obtained with conductive powders having particle sizes in the range of 0.5 to 2.5 microns. Vias are formed by developing the charged pattern with conductive bodies such as spheres having a dimension similar to the finished thickness of the lamina or substrate. After development, the conductive bodies may be embedded within the lamina or substrate, possibly facilitated through the use of heat and lamination techniques. Insulative particulate material may also be used to form insulating patterns. A sequence of direct electrostatic writing and development operations enable the production of microstructures such as capacitors and multiple wiring layers on a single lamina or substrate.