The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 1994

Filed:

Feb. 16, 1993
Applicant:
Inventors:

Tetsuo Machida, Miyagi, JP;

Hiroyuki Kiso, Miyagi, JP;

Nobuyuki Sasaki, Miyagi, JP;

Hiroshi Kondo, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
2643287 ; 264334 ; 425139 ; 425555 ; 425556 ;
Abstract

An injection molding die includes a fixed half die and a movable half die which has a core surface and which is provided with ejector pins. The ejector pins are held with their extremities retracted from the core surface to form recesses corresponding to compression allowances. The ejector pins are advanced toward the cavity to compress the compression allowances after a molten resin has been injected into the injection molding die in a manner which fills the cavity and the recesses. The compression with the ejector pins renders the pressure distribution int he cavity uniform, so that a molding can be formed with a high degree of accuracy and so that the injection molding cycle time can be reduced.


Find Patent Forward Citations

Machida, Tetsuo. (1994). Injection/compression molding method, a die for injection/compression (U.S. Patent No. 5340528). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5340528

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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