The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 1994

Filed:

Apr. 20, 1993
Applicant:
Inventors:

Isaac Cohen, Dix Hills, NY (US);

William Svoronos, Hauppauge, NY (US);

Assignee:

Lambda Electronics, Inc., Melville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361707 ; 174252 ; 428209 ; 428901 ;
Abstract

A composite printed circuit board includes a metal substrate printed circuit section and an insulation substrate printed circuit board section. The metal substrate printed circuit section includes a first layer of a thermally conductive metal for providing high thermal conductivity, and a second layer made of a thermally conductive and electrically insulative material disposed adjacently to said first layer. The second layer has an upper surface upon which electrically conductive wiring may be disposed. The insulator substrate printed circuit board section forms an integral surface with the metal substrate printed circuit section. The insulator substrate printed circuit section further includes a first layer of insulative material, and a second layer of a metallic foil disposed adjacently to at least one side of said first layer of insulative material for forming a conductive wiring layout.


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