The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
Mar. 02, 1993
Applicant:
Inventors:
Peng-Cheng Lin, Cupertino, CA (US);
Hem P Takiar, Fremont, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361707 ; 257707 ; 257713 ; 257777 ; 361723 ;
Abstract
In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.