The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 1994

Filed:

May. 18, 1993
Applicant:
Inventors:

Hiroyuki Umetani, Iwakuni, JP;

Takeyoshi Yamada, Iwakuni, JP;

Assignee:

Teijin Limited, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525126 ; 525131 ; 525903 ;
Abstract

One of the objects of the present invention is to produce a shaped article of a cured resin having well-balanced heat resistance and toughness by using a plural liquid pack type heat-curable resinous composition of a low liquid viscosity and excellent handling property with good storage stability. As claimed in the present invention, individual components comprising a polyisocyanate compound (a), a radically polymerizable unsaturated monomer compound bearing no functional group reactive with isocyanate, for example, styrene or a (meth)acrylic acid derivative (b), a polyol compound bearing no radically polymerizable unsaturated bond such as a polyether polyol (c), a radical catalyst (e) and a ring-forming catalyst (d) are separated into 2 liquid packs or 3 liquid packs, and they are mixed on molding, fed into the mold, and reaction-cured in the mold to give a shaped article of a cured resin of excellent heat resistance, toughness and other properties.


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