The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
Nov. 20, 1992
Thomas S Kohm, Huntington, NY (US);
AMP-AKZO Corporation, Newark, DE (US);
Abstract
This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.