The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
Sep. 28, 1992
Kohji Hayakawa, Komatsu, JP;
Yosuke Sasaki, Zama, JP;
Kabushiki Kaisha Komatsu Seisakusho, Tokyo, JP;
Abstract
A molding apparatus with die-clamping and alignment devices has a stationary die plate for holding a stationary die, a movable die plate for holding a movable die, a device for moving forwardly/rearwardly the movable die plate with respect to the stationary die plate, a fastening device for fastening the movable die plate and the tie bar to each other by hydraulic force when the stationary die and the movable die have been approached to predetermined positions, and a tie bar for clamping the movable die and the stationary die by die-clamping force generated by a die-clamping cylinder, and a primary alignment mechanism provided for at least one junction among junctions between a piston of a die-clamping hydraulic cylinder and the tie bar, between a support plate and the tie bar, and between the movable die plate and a movable die plate support member, in order to permit the two dies to be aligned to each other by a secondary position alignment function, such as a guide pie for aligning the two dies at the time of clamping the dies.