The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 1994

Filed:

Dec. 30, 1991
Applicant:
Inventors:

Toyofumi Watanabe, Tokyo, JP;

Akihiko Furuta, Tokyo, JP;

Tadashi Ono, Tokyo, JP;

Yoshinori Yomura, Tokyo, JP;

Shuichi Iwado, Tokyo, JP;

Assignee:

NKK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
428629 ; 428679 ; 428935 ; 205191 ; 205258 ; 205109 ;
Abstract

A nickel alloy electroplated cold-rolled steel sheet excellent in press-formability and phosphating-treatability, which comprises: (a) a cold-rolled steel sheet consisting essentially of: carbon (C): up to 0.06 wt. %, silicon (Si): up to 0.5 wt. %, manganese (Mn): up to 2.5 wt. %, phosphorus (P): up to 0.1 wt. %, sulfur (S): up to 0.025 wt. %, soluble aluminum (Sol.Al): up to 0.10 wt. %, nitrogen (N): up to 0.005 wt. %, and the balance being iron (Fe) and incidental impurities; (b) a nickel alloy electroplating layer, formed on at least one surface of the cold-rolled steel sheet, the nickel alloy electroplating layer consisting of nickel alloy particles precipitated at a distribution density of at least 1.times.10.sup.12 /m.sup.2, the nickel alloy particles containing at least one of phosphorus (P), boron (B) and sulfur (S) in an amount of 1 to 15 wt. %, the plating weight of the nickel alloy electroplating layer being 5 to 60 mg/m.sup.2 per surface of said cold-rolled steel sheet; and (c) a nickel alloy oxide film, formed on the surface of the nickel alloy electroplating layer, having an average thickness of 0.0002 to 0.005 .mu.m.


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