Cooling assembly for an integrated circuit

Abstract

A cooling assembly includes a fin, a fan retained above the fin, and a housing. The fin includes a bottom surface for contacting an upper surface of the integrated circuit and an upper surface from which a plurality of ridges extend, each two adjacent ridges defining a channel therebetween. A plurality of venting openings are formed in a top wall of the hollow housing. A plurality of snapping members project downwardly from two mutually facing side walls of the hollow housing and each of which having a distal flexible snapping end for releasably engaging with an underside of the integrated circuit. A pair of ribs are formed in an upper section of each of two mutually facing inner sides of the side walls of the hollow housing, the distance between opposite ribs being equal to a width of the integrated circuit. A plurality of oblique flexible pieces extend from an inner side of the top wall of the hollow housing. A groove is formed in an outer side of each of two outermost ridges and extends along a longitudinal direction of the ridges, and a protrusion is formed in a lower section of each of two mutually facing inner sides of the side walls of the hollow housing for engaging with an associated groove.