The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 1994
Filed:
Sep. 13, 1991
Richard A Metzler, Mission Viejo, CA (US);
Mark Kalatsky, Laguna Beach, CA (US);
Other;
Abstract
A package for a semiconductor device includes multiple layers which are fused together to encapsulate the device in a package which has a size approaching the size of the unpackaged device. The compact package facilitates heat transfer from the device, thus making it particularly advantageous for high power applications. Electrical contacts with the device are provided as contact pads on the surface of the package. Primary materials used in construction of the package include glass and ceramics, although other materials such as resins and epoxy could also be used. The multiple layers comprising the package are welded or fused together without having any adhesive, solder, etc. between the layers. Thus, the assembly of the package is an efficient one step process wherein electrical and thermal contacts with the electronic device are made simultaneously with the sealing operation.