The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 1994
Filed:
Apr. 06, 1992
Timothy J Mennitt, Cedar Park, TX (US);
John P Warren, Austin, TX (US);
James W Sloan, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device has test-only contacts to reduce the size of the device and eliminate unnecessary external contacts. In one form of the invention, a semiconductor device (30) is provided with solder balls (26) which are electrically coupled to those portions of a semiconductor die (20) that are necessary for device operation. The device also includes test pads (32) formed on a package substrate (12) which are electrically coupled to those portions of the die which are necessary only for a manufacturer's testing purposes. In another form, a semiconductor device (10) includes external test-only solder balls along the periphery of the package substrate, for example solder balls between boundaries A and B. After testing is complete, the package substrate is excised along boundary A, thereby eliminating solder balls which are not needed by the device user. A combination of the two techniques may also be used.