The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 1994

Filed:

Jun. 23, 1992
Applicant:
Inventors:

Takayoshi Imoto, Otsu, JP;

Toshio Okahashi, Higashiosaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
428 362 ; 428 3691 ; 428286 ; 428290 ; 138 98 ; 138128 ;
Abstract

A lining material for pipe lines, especially those buried in the ground such as sewage pipe lines, and a process for providing such pipe lines therewith, includes a flexible tubular film, a resin-impregnated sheet covering the outer surface of the flexible tubular film, and a tubular covering material having a strong resistance to tensile force. The sheet may be constructed by several units of sheet fractions which are overlapped in both lateral end portions so as to be slidable over each other in opposite directions to form a tubular sheet. The lining material is applicable for repair/and reinforcement to the inner surface of a pipe line having damages portions. According to the process for providing pipelines with this lining material, thermocuring of the lining material applied onto the inner surface of a pipe line can be carried out by moving a nozzle for jetting pressurized steam from one end to the other end of the pipe line without applying high pressure to the pipe line. Thus, this process is particularly suited for applying a lining material to a superannuated sewage pipe line or general sewage pipe lines having damaged portions.


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