The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 1994

Filed:

Aug. 03, 1993
Applicant:
Inventors:

Lawrence Jacobowitz, Poughkeepsie, NY (US);

Mario E Ecker, Poughkeepsie, NY (US);

Casimer M DeCusatis, Lake Katrine, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ; G02B / ;
U.S. Cl.
CPC ...
385 93 ; 333254 ; 385 88 ;
Abstract

Obtains a large increase in the number of fiber optic inputs/output (I/O) lines connectable to a module by enabling edge connection of multiple clusters of optical fibers to be connected around a module. Each connector connects a cluster of optical fibers in a small dimension of space on the module. Many distinct pluggable connectors may be provided along one or more edges of a module. The optical-fiber cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM), containing an integrated photonic receiver and/or transmitter for each fiber. Each connector supports a large number of fibers from a single cable, and a large number of connectors may be provided in a single module. Easy plugging and unplugging is obtained for each connector without interferring with any existing cooling apparatus or I/O pins of the module. Receptacle and plug assemblies which hold the fibers in respective key V-grooves etched in silicon members which carry and interlock each fiber in each receptacle. Alignment and locking means is provided in each connector for aligning a plug's array of fibers with corresponding receptacle fibers in one or more angled groove(s) in a receiving receptacle. Thermal coefficients of expansion match between the silicon receptacle and the glass-ceramic substrate to guarantee the preservation of opto-mechanical alignments.


Find Patent Forward Citations

Loading…