Mark cutting apparatus and method of controlling same

Abstract

Marks such as patterns, designs, numbers, or the like are cut out of a mark sheet or mark sheets placed on a glass base by a thermal cutter having a heated cutting bit. The thermal cutter is movable two-dimensionally over the mark sheet, and is also vertically movable between an upper position in which the thermal cutter is lifted off the mark sheet supported on the base and a lower position in which the thermal cutter is lowered in contact with the mark sheet supported on the base. The thermal cutter is angularly movably supported on an eccentric shaft that is rotatable by a stepping motor. The thermal cutter has a cutting bit resiliently urged by a spring for stable positioning. A range or ranges in which desired marks are to be cut out of a mark sheet or mark sheets can be confirmed by being traced by the thermal cutter before the marks are actually cut out. When mark numerals indicative of desired numbers are to be cut out, such mark numerals are rearranged and displayed for the operator's information. The thermal cutter can be cleaned by a cutter cleaner in a different cleaning pattern each time the thermal cutter has moved a predetermined distance in contact with the mark sheet or mark sheets. The thermal cutter moves to the cutter cleaner and also to a position to start cutting out desired marks, at a higher speed than the speed at which it cuts out the desired marks.