The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 1994

Filed:

Sep. 23, 1993
Applicant:
Inventors:

Ismail T Emesh, Cumberland, CA;

Iain D Calder, Kanata, CA;

Vu Q Ho, Kanata, CA;

Gurvinder Jolly, Orleans, CA;

Lynnette D Madsen, Ottawa, CA;

Assignees:

Northern Telecom Limited, Montreal, CA;

McMaster University, Hamilton, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 60 ; 437 47 ; 437 52 ; 437919 ;
Abstract

A method is provided for forming a capacitor structure for a memory element of an integrated circuit. The method comprises providing a first conductive electrode, forming a layer of a first dielectric material thereon, opening a via hole through the dielectric layer, providing within the via opening a capacitor dielectric having a higher dielectric strength than the first dielectric, the capacitor dielectric contacting the first electrode, planarizing the resulting structure and then forming a second conductive electrode thereon. Preferably, when the second dielectric comprises a ferroelectric dielectric material, sidewalls of the via opening are lined with a dielectric barrier layer to provide diffusion barrier between the ferroelectric and first dielectric layer. Advantageously, planarization is accomplished by chemical mechanical polishing to provide fully planar topography. The method provides a capacitor of a simple, compact structure which may be integrated with CMOS, Bipolar and Bipolar CMOS processes for submicron VLSI and ULSI integrated circuits.


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