The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 1994
Filed:
Jan. 24, 1994
Applicant:
Inventor:
Thomas D Belanger, Jr, Saline, MI (US);
Assignee:
Ford Motor Company, Dearborn, MI (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
22818022 ; 228260 ; 228 37 ;
Abstract
A printed circuit board is provided with a solder pad configuration for wave soldering a surface mount device with its longitudinal axis in a direction perpendicular to the solder wave. A leading solder pad is not wider than the surface mount device. A trailing solder pad is wider than the surface mount device, thereby ensuring that the trailing pad is sufficiently wet by the solder wave.
Quick Actions:
Belanger, Jr, Thomas. (1994). Method of wave soldering with unique solder pad configuration (U.S. Patent No. 5330096). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5330096
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile