The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 1994
Filed:
Dec. 07, 1992
Yoshihisa Tsuji, Hadano, JP;
Sigeru Ninomiya, Tokyo, JP;
Kazuo Kato, Yamato, JP;
Mamoru Kobayashi, Hadano, JP;
Akio Kojima, Hadano, JP;
Hideaki Sasaki, Hadano, JP;
Tetsuhiro Yokoyama, Hadano, JP;
Hitachi, Ltd., Hadano, JP;
Hitachi Computer Engineering Co., Ltd., Hadano, JP;
Abstract
A method of supplying parts in a system for assembling a printed circuit board by mounting the parts on a substrate at corresponding predetermined positions thereof. One or more kinds of substrates and at least one group of parts, to be mounted on the corresponding substrates, are introduced into the system lot by lot. The introduced parts on one or more previously prepared parts containers are placed so as to correspond to the substrates on which the individual parts are to be mounted, thereby providing one or more sets of the parts, each set corresponding to a respective one of the substrates. The sets of parts are supplied to a parts mounting station of the system.