The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1994
Filed:
Mar. 08, 1993
Applicant:
Inventor:
Roupen L Keusseyan, Raleigh, NC (US);
Assignee:
E. I. Du Pont de Nemours and Company, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
148 22 ; 148 24 ;
Abstract
A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.
Keusseyan, Roupen. (1994). Kinetic solder paste composition (U.S. Patent No. 5328521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5328521
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile