The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1994
Filed:
Sep. 22, 1992
Takushi Itagaki, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for producing a linear pattern having a width less than 100 microns and a resistivity of the order of 10.sup.-6 .OMEGA..multidot.cm on a substrate includes maintaining a low melting point metal in its fused state, applying the fused metal to a tip of a drawing head disposed close to or contacting a substrate by capillary action, applying the fused metal to the substrate in a line with a width less than 100 microns while moving the tip of the drawing head relative to the substrate, and cooling and solidifying the linear pattern of fused metal. Therefore, a linear pattern having a width less than 100 microns and a resistivity of the order of 10.sup.-6 .OMEGA..multidot.cm is directly formed on the substrate in a simple process with high efficiency and the production yield is significantly improved.