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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5328155 B1

PDFFull Text
Date of Patent:
Jul. 12, 1994

Filed:

Sep. 16, 1993

Method and apparatus for laying and collecting a wire

Applicant:
Inventors:

Hiroaki Sano, Kanagawa, JP;

Kuni Hayashi, Tokyo, JP;

Yoshiaki Terasawa, Kanagawa, JP;

Shigeru Tanaka, Kanagawa, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Attorney:

Cushman, Darby & Cushman

Primary Examiner:

Bruce M Kisliuk

Assistant Examiner:

Eileen P Morgan

Int. Cl.
CPC ...
B65H / ;
U.S. Cl.
CPC ...
2541344 ; 2541 / ;
Abstract

A wire laying apparatus comprising a first carrier member, a second carrier member having one end connected to the first carrier member, a communication wire disposed within the second carrier member, and a compressor connected to and supplying a fluid under pressure to a second end of the second carrier member through which the fluid supplied by the compressors serves to move the communication wire from the second carrier member to the first carrier member. The wire laying apparatus may be restructured to serve as a wire collecting apparatus.

Find Patent Forward Citations

Sano, Hiroaki. (1994). Method and apparatus for laying and collecting a wire (U.S. Patent No. 5328155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5328155

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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