The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1994
Filed:
Feb. 08, 1993
Earl R Nicewarner, Jr, Gaithersburg, MD (US);
Fairchild Space and Defense Corporation, Germantown, MD (US);
Abstract
An integrated circuit package that permits high density packaging of circuit chips. The integrated circuit package has a base substrate support member with an upper and a lower surface. A cavity is located in its upper surface and a similar cavity is located in its lower surface. Two circuit chips are located in each cavity that are connected together in back to back relationship. The cavities are closed or sealed by lids that are bonded to mounting surfaces that are located on the base substrate support member and surround the cavities. A series of terminating leads are located on two sides of the base substrate support member that are electrically connected to the circuit chips. A single cavity embodiment is also set forth that is designed for use when a lesser density is acceptable or desired.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile