The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1994
Filed:
Jul. 31, 1992
Hitachi, Ltd., Tokyo, JP;
Abstract
A magnetoresistance effect type head including a ceramic substrate, a first magnetic film provided on the ceramic substrate, a second magnetic film provided above the first magnetic film, first and second insulating films provided between the first and second magnetic films, a magnetoresistance effect type film provided between the first and second insulating films, a bias film provided between the first and second insulating films in contact with the magnetoresistive film for applying magnetic field to the magnetoresistive film, a first conductive film provided between the first and second insulating films and above the bias film to be nearly as thick as the mean free path of free electrons, and a second conductive film of an electrode structure mutually separated between the first and second insulating films in contact with the first conductive film. The first conductive film is a nickel-chromium film or a chromium film which is resistive to a fluorocarbon-series gas to be used for etching. The second conductive film is made of a metal which is etched with a fluorocarbon-series gas and which has a thickness of 200 nm or more. The bias film and the magnetoresistance effect type film are protected from over-etching. The second conductive layer is made up of two metallic layers having contact tightness with the second insulating film and a third metallic layer which is sandwiched between the two metallic layers and which has a conductivity larger than the two metallic layers and also a thickness larger than the two metallic layers.