The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1994
Filed:
Jul. 17, 1990
Applicant:
Inventors:
Takeshi Uenaka, Sanda, JP;
Jun Ohbuchi, Itami, JP;
Shigeo Onoda, Itami, JP;
Makoto Omori, Itami, JP;
Hajime Maeda, Itami, JP;
Toru Tachikawa, Itami, JP;
Assignees:
Ryoden Kasei Co., Ltd., Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; G06K / ;
U.S. Cl.
CPC ...
257679 ; 257678 ; 257687 ; 235487 ; 235488 ; 235492 ; 174 524 ;
Abstract
An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.