The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1994
Filed:
Oct. 25, 1993
Applicant:
Inventors:
Makoto Morita, Neyagawa, JP;
Masaru Nagaike, Hirakata, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281101 ; 228-11 ;
Abstract
A head of an ultrasonic wire bonding apparatus for bonding a lead wire to a lead frame, includes a capillary, a capillary supporting member, and a vibrator, vertically arranged and connected to the capillary supporting member, for producing ultrasonic torsional vibration along opposite directions and applying the vibration to the capillary via the capillary supporting member, the vibrator having two piezoelectric elements superimposed on each other via a column member in which magnets are circularly arranged so as to produce the ultrasonic torsional vibration along the opposite directions.