The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 1994
Filed:
Apr. 14, 1993
Applicant:
Inventors:
Charles D Iacovangelo, Schenectady, NY (US);
Raymond A Fillion, Niskayuna, NY (US);
James F Burgess, Schenectady, NY (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257701 ; 257705 ; 257707 ; 257720 ;
Abstract
Differences in thermal expansion properties between integrated circuit chips, especially of gallium arsenide, and the dielectric substrates (especially diamond and aluminum nitride) on which said chips are mounted are accommodated by interposing between the substrate and the chip a base having diamond pedestals in combination with a material of higher coefficient of thermal expansion than the substrate, typically a metal such as copper or tungsten. The base may be integral with a diamond substrate or may be a shim interposed between the substrate and the chip.